Download e-book for kindle: 3D IC Stacking Technology by Banqiu Wu, Ajay Kumar, Sesh Ramaswami

By Banqiu Wu, Ajay Kumar, Sesh Ramaswami

ISBN-10: 007174195X

ISBN-13: 9780071741958

The most modern advances in third-dimensional built-in circuit stacking technology

With a spotlight on business purposes, 3D IC Stacking Technology bargains accomplished insurance of layout, attempt, and fabrication processing tools for three-d equipment integration. every one bankruptcy during this authoritative advisor is written by means of specialists and info a separate fabrication step. destiny functions and state of the art layout power also are mentioned. this can be a necessary source for semiconductor engineers and transportable gadget designers.

3D IC Stacking Technology covers:

  • High density via silicon stacking (TSS) technology
  • Practical layout atmosphere for heterogeneous 3D IC products
  • Design automation and TCAD device ideas for via silicon through (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper...
  • Show description

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    Extra info for 3D IC Stacking Technology

    Sample text

    9. 9 2 × 2 × 2 3D NOC topology. Each seven-port switch in the network is connected by a bidirectional link to intra-tier switches positioned North, South, East, and West. Two other ports connect each switch in the upper to lower tiers, and one port connects the switch to the processor or memory-resource node. With a shared bus architecture, the performance improvement from adding more processor nodes and more 3D tiers generally diminishes. 3D NOC architecture is significantly more scalable and extends the performance improvement window to greater number of processor cores and 3D tiers [23,24].

    Seoul, Korea (CHAP. , St. Florian am Inn, Austria (CHAP. , Sunnyvale, California (CHAP. , St. Florian am Inn, Austria (CHAP. , Sunnyvale, California (CHAP. , St. Florian am Inn, Austria (CHAP. , Sunnyvale, California (CHAP. , Mountain View, California (CHAP. 3) Foreword T he explosive growth in the market for electronic systems has been propelled by strong consumer demand for personal computers, mobile phones, music players, gaming systems, cameras, and flash media, to name a few. These electronic systems are designed and manufactured by assembling individual integrated circuits into portable form factors.

    Reduction of materials costs, such as temporary adhesives and underfills, should occur as volumes ramp. Another key aspect of manufacturing cost relates to yield. High-yielding vias and tier-to-tier connections are required for high-volume manufacturing. Impact of incorporating TSVs on-chip area must also be considered. TSVs and associated tier-to-tier driver and ESD protection circuits occupy valuable silicon area and may introduce interconnect routing blockages, which can result in increased chip area.

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    3D IC Stacking Technology by Banqiu Wu, Ajay Kumar, Sesh Ramaswami

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